International Symposium for Design and Technology in Electronic Packaging

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International Symposium for Design and Technology in Electronic Packaging SIITME - IEEE International Symposium for Design and Technology in Electronic Packaging

🎉 Happy New Year 2026 dear   community!🌿At the beginning of the Year 2026 we are happy to announce the publication of th...
07/01/2026

🎉 Happy New Year 2026 dear community!🌿

At the beginning of the Year 2026 we are happy to announce the publication of the 2025 IEEE 31th International Symposium for Design and Technology in Electronic Packaging (SIITME) Brașov, România in the digital repository, IEEEXplore.

https://lnkd.in/drtryPne

This achievement marks a milestone in the dissemination of scholarly research and technological advancements within the field of electronic packaging.

www.siitme.ro

🍀 A prosperous, peaceful and healthy New Year 2026! 🍀

16/10/2025
5 days to go! The 4th IEEE EPS & NTC Student Branch Chapters Summit When students meet, ideas start to flow and the futu...
16/10/2025

5 days to go! The 4th IEEE EPS & NTC Student Branch Chapters Summit

When students meet, ideas start to flow and the future of electronics packaging moves with them!

Next Tuesday we meet in Brașov 🇷🇴, Romania
📅 21 October 2025
🎓 Part of the 31st International Symposium on Design and Technology in Electronics Packaging ( ) www.siitme.ro

This summit brings together students, researchers, and industry from 🇷🇴 , 🇭🇺 and 🇧🇬 to learn, share, and connect through the latest advances in Electronics Packaging and .

Detailed program: https://lnkd.in/dNayQebd

Summit Brochure
https://sites.google.com/ulbsibiu.ro/sbc-summit/brochure?authuser=0

Here’s what’s on the program:
↗️ Keynotes on modern applications — from digital forestry and smart agriculture to advanced system-in-package technologies.
↗️ Student chapter reports and discussions on future cooperation between EPS & NTC SBCs across Central and Eastern Europe.
↗️ Company visit to Miele Tehnica Romania Feldioara, offering insights into R&D and manufacturing processes.
↗️ Cultural visit to Feldioara Fortress, rounding off a full day of learning and connection.

The day will close with a networking dinner a perfect chance for students and experts to share experiences and build lasting collaborations.

👉 Join us in Brașov and be part of a growing community shaping the future of and !

🏛️ Organisers IEEE EPS & NTC Student Branch Chapters (SBCs)
from Bulgaria, Hungary, and Romania, including:
IEEE EPS&NTC SBC, Budapest University of Technology and Economics
IEEE EPS SBC, University of Ruse "Angel Kanchev"
IEEE EPS SBC, Universitatea Tehnică din Cluj-Napoca
IEEE EPS SBC, Universitatea "Lucian Blaga" din Sibiu
IEEE EPS SBC, Gheorghe Asachi​ Technical University of Iașiși
IEEE EPS SBC, National University of Science and Technology Universitatea POLITEHNICA din București
IEEE NTC SBC, POLITEHNICA Bucharest
IEEE Hu&Ro EPS&NTC Joint Chapter

💼 Sponsors / Partners: Miele (Feldioara, Brașov, Romania)
Sponsor of the Welcome & Networking Lunch
Host of the company visit and R&D plant tour.

🚀 Join the 31st IEEE 2025 International Symposium for Desing and Technology in Electronic Packaging   unlock endless opp...
15/09/2025

🚀 Join the 31st IEEE 2025 International Symposium for Desing and Technology in Electronic Packaging unlock endless opportunities for networking and knowledge sharing.

22-25..October 2025, University of Brașov, Romania!

🌐 Don't miss out on the chance to register for this transformative event. Elevate your industry presence and connect with electronics packaging experts.

Secure your spot today:

🔗 Participants conference registration until 15.10.2025
https://siitme.ro/conference-registration/

🔗 Be a Sponsor or Exhibitor registration until 30.09.2025
https://siitme.ro/2025-edition/sponsors-exhibition-registration/

Expand your horizons, connect with industry leaders, and stay ahead of the curve.

Looking forward to seeing you in Brașov!


🎉 Celebrating 30 Years of Innovation, Research, and Collaboration at Center for Technological Electronics and Interconne...
07/07/2025

🎉 Celebrating 30 Years of Innovation, Research, and Collaboration at Center for Technological Electronics and Interconnection Techniques (CETTI) 🎉

“Fugit irreparabile tempus.” Virgiluis . Time truly does fly, but some places leave a permanent mark on who we become.

For three decades, CETTI has stood at the forefront of research and education in electronics packaging and interconnection technologies. It’s a living, evolving community of knowledge, creativity, and collaboration.

💡 One name stood out once again at the celebration: Prof. em. dr. h.c. mult. ing. Paul Svasta. A visionary leader and founder of , Prof. Svasta’s unwavering dedication continues to shape the center’s future. Even now, after 30 years, his guidance, mentorship, and scientific rigor are central to CETTI’s identity.

🔧 Highlights:

1. Pioneering Research in Electronics Packaging:
CETTI has made a name for itself in passive components, advanced interconnection systems, and reliability engineering. With numerous publications, EU projects, and partnerships, its influence spans well beyond Romania.

2. Real-World Education for Future Engineers:
Thousands of students have learned not just theory but real-world application through CETTI’s state-of-the-art labs and close ties with industry.

3. A Global, Collaborative Spirit:
From hosting international conferences to driving research in sustainable and intelligent electronics, CETTI continues to shape a connected world and connect people across disciplines and borders.

💡 Key takeaways:

🔹 People first: Behind every lab, every project, every breakthrough there are people. Passionate professors, dedicated researchers, curious students, and visionary partners.

🔹 Innovation with impact: CETTI’s work bridges academic rigor with real-world relevance from electronics packaging to sustainable systems, with results that travel far beyond Romania.

🔹 Community and continuity: What impressed me most was the sense of community a room filled with mentors, alumni, and current students, all sharing a commitment to innovation with purpose.

🔗 More about CETTI’s journey

🚀 CALL FOR PAPERS 31st IEEE International Symposium for Design and Technology in Electronic Packaging   is officially op...
06/06/2025

🚀 CALL FOR PAPERS 31st IEEE International Symposium for Design and Technology in Electronic Packaging is officially open!

The organizing committee kindly invites you to submit an abstract to the IEEE 31st , organized in Brașov, Romania. The scientific event will be held on October 22nd–25th, 2025.

📅IMPORTANT DATES
Abstract submission (2 pages): July 1, 2025
Notification of abstract acceptance: 1st August 2025
Authors and participants registration EARLYBIRD: 1st September 2025
🔗 https://siitme.ro/

SUBMISSION OF ABSTRACTS AND PAPERS
Interested authors are invited to submit a two-page abstract according to the template, as MS-Word document and as PDF document, using the SIITME Conference Management System. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

📢 Why submit your paper?
✅ Present your research to an international audience of experts
✅ Gain insights from industry leaders and academic pioneers
✅ Expand your professional network and foster collaborations

🔬 TOPIC OF INTEREST:
✅ Emerging Topics in Advanced Packaging
✅ New Components and Manufacturing Technologies
✅ Printed Electronics, Smart Textiles & Healthcare
✅ Sensors, Actuators & Microsystems
✅ Nanomaterials, Nanoelectronics & Nanotechnology
✅ Embedded Systems, Robotics & Artificial Intelligence
✅ Power Electronics & Thermal Management
✅ Smart Grid & Renewable Energy
✅ Virtual Prototyping & System Validation
✅ Quality Management, Reliability & Failure Diagnosis
✅ Corrosion in Electronics
✅ Challenges in Digitalisation & Global Education for Electronics

21/03/2025

🎉 Congratulations to This Year's TIE-E Local Phase Participants! 🎉

We are thrilled to announce the outstanding contestants who showcased their skills and creativity in the TIE-E Local Phase of the POLITEHNICA Bucharest Competition.
A heartfelt congratulations to all participants:
• Erdic-Arseni Antonio-Gabriel
• Neamtu Marian
• Rusu Vlad-Alexandru
• Rocsin Dragos Teodor
• Mumoiu Robert-Mihai
• Simion Andrei Alexandru
Your achievements inspire us all, and we commend you for stepping up to this challenge. Whether you’re advancing to the next round or concluding your journey here, remember that this is just the beginning of many great accomplishments ahead.

To those moving forward: best of luck in the next stages! To all participants: keep pushing boundaries, learning, and growing—your futures are bright!

🌟 Best wishes for continued success! 🌟

— TIE-E Organizing Committee | POLITEHNICA University of Bucharest

20/03/2025
🚀 34th Edition of Technologies of Interconnections in Electronics (TIE) - Industry-wide Student Challenges! TIE is comin...
17/03/2025

🚀 34th Edition of Technologies of Interconnections in Electronics (TIE) - Industry-wide Student Challenges!
TIE is coming to Brașov, Romania, from April 2nd to 5th, 2025

For over three decades, TIE has been at the forefront of advancing interconnection technologies, bringing together industry experts, researchers, and students to explore the latest innovations shaping the future of electronics packaging, microelectronics, and system integration.

💡 Why attend?
✅ Cutting-edge discussions in TIE-E | TIE-E+ | TIE-M | TIE-M+ | TIE-T+ | TIE-µ
✅ Hands-on experiences and networking with industry leaders
✅ A platform to exchange knowledge, ideas, and breakthroughs

Join us in Brașov and be part of the next wave of technological advancements!

Let’s connect, innovate, and push the boundaries of electronics packaging together!

📍 Save the date: April 2-5, 2025
🔗 More info: https://www.tie.ro/

🎉 Happy New Year 2025 dear SIITME community!At the beginning of the Year 2025it is a great pleasure to announce the publ...
03/01/2025

🎉 Happy New Year 2025 dear SIITME community!

At the beginning of the Year 2025
it is a great pleasure to announce the publication of the 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) Sibiu, România in the esteemed digital repository, IEEE Xplore.
https://lnkd.in/deqb9zxA

🚀 This significant achievement marks a milestone in the dissemination of scholarly research and technological advancements within the field of electronic packaging.

SIITME 2024 Publication and Steering Committee

🎄 Wishing you all a Merry Christmas and a New Year 2025 filled with innovation, collaboration, peace and success, IEEE S...
17/12/2024

🎄 Wishing you all a Merry Christmas and a New Year 2025 filled with innovation, collaboration, peace and success, IEEE SIITME Steering Committee!

As we wrap up another remarkable year in electronics packaging innovation, we want to extend our warmest holiday wishes to our incredible community of students, researchers, sponsors, and partner universities. Your dedication to advancing technology and fostering collaboration has made our symposium a continued success for over three decades.

🌟 Looking ahead to 2025, we're thrilled to announce that in the heart of Transylvania the beautiful city of Brasov , Romania will host:
➡️ the 34th Technologies of Interconnections in Electronics (hashtag ), Professional Student Contest from April 2nd-5th, 2025 https://tie.ro/.
➡️ the IEEE 31st International Symposium for Design and Technology in Electronic Packaging (hashtag ) from October 22nd-25th, 2025 https://siitme.ro/.

🎯 To our students: Your fresh perspectives and enthusiasm drive innovation forward
🔬 To our researchers: Your expertise shapes the future of electronics packaging
🤝 To our sponsors Continental, NXP Semiconductors, Bosch, Rohde & Schwarz, Eberspächer Group, Syntegra, Microchip Technology Inc., ifm, Miele and many more : Your support makes scientific advancement possible
🎓 To our universities: Your commitment to excellence inspires the next generation

Join us in Brasov for SIITME 2025 - where tradition meets innovation, and where your hobby can truly become your profession! Mark your calendars and stay tuned for more updates. Abstract submissions will open soon!

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