20/08/2026
📢 congatec conga-HPC/mIQ-X: Built for Security, Transactional Retail and Industrial Automation
Security systems and transactional retail infrastructure increasingly run on compact, always-on edge devices that must keep working without a stable cloud connection.
That requires reliable on-device AI processing for real-time video and transaction analysis, hardware-based protection for locally stored data, and a compact form factor with direct multi-camera integration.
Powered by Qualcomm® Dragonwing™ IQ-X processors with up to 12 Oryon™ CPU cores, the conga-HPC/mIQ-X from combines dedicated NPU acceleration, TPM 2.0 hardware-based security and direct multi-camera connectivity in one COM-HPC Mini module.
Highlights
▪️ Qualcomm® Hexagon™ NPU delivering up to 45 TOPS for on-device AI inference
▪️ Direct connectivity for up to 4 MIPI CSI cameras via the Qualcomm® Spectra™ ISP
▪️ Up to 64GB soldered LPDDR5x memory with UFS 4.0 storage up to 1TB
▪️ Up to 16× PCIe lanes (12× Gen4 + 4× Gen3), 2× USB4 and dual 2.5GbE for flexible I/O expansion
▪️ Industrial temperature range from -40°C to +85°C for continuous, always-on operation
🔗 Learn more: https://www.aaronn.de/blog/skalierbare-arm-performance-im-com-hpc-mini-format/
🔗 congatec conga-HPC/mIQ-X at Aaronn: https://www.aaronn.de/produkte/board-level/computer-on-modules/com-hpc/conga-hpc-miq-x/