ISMI 2018 & IEEE SMILE 2018 February 7 - 9, 2018, Hsinchu, Taiwan

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ISMI 2018 & IEEE SMILE 2018 February 7 - 9, 2018, Hsinchu, Taiwan Details can be found at http://dalab.ie.nthu.edu.tw/ISMI2018/

2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2018) & 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (IEEE SMILE 2018) ,Feb. 7-9, Hsinchu, Taiwan 2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2018) & 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Enginee

ring (IEEE SMILE 2018) aims to disseminate recent theoretical and methodological developments, significant technical applications, and case studies in semiconductor and high-tech manufacturing. Following the great success of ISMI in Taiwan (2012), Shanghai (2013) Taiwan (2014), and South Korea (2015), Taiwan(2016), 2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2018) & 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (IEEE SMILE 2018) will be held on National Tsing Hua University in Hsinchu, Taiwan, and serve to enhance collaborations among academia and industries.

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No. 101, Section 2, Kuang-Fu Road, Hsinchu, Taiwan 30013, R.O.C.
Hsinchu
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